Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1995-06-07
1997-12-30
Ramsey, Kenneth J.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228 45, 2281805, H01L 21607
Patent
active
057020493
ABSTRACT:
An alignment method for ultrasonic wire bonders of the type using capillary ball type and wedge type bonding tools utilizes a bonding tool construction having an elongated shank angle obliguely At any desired azimuthal angle from the lower working face of a tool tip. This angular offset allows a workpiece to be positioned laterally to place a desired wire bond site on an integrated circuit or other such workpiece in precise alignment with a target image in the field of view of a television camera or other optical imaging device viewing the location of a desired bond site along the line of action of the tool tip. Because of the angular offset construction of the bonding tool, the line of site of the imaging device is coincident with the line of action of the tool tip eliminating parallax errors and permitting viewing of the bond site continuously during motion of the tool tip along its line of action.
REFERENCES:
patent: 3461538 (1969-08-01), Worcester et al.
patent: 4817848 (1989-04-01), Gabaldon
patent: 4855928 (1989-08-01), Yamanaka
patent: 5437405 (1995-08-01), Asanasavest
patent: 5445306 (1995-08-01), Huddleston
patent: 5495976 (1996-03-01), Mironesco et al.
Biggs Kenneth L.
Price John Cairl
Chapin William L.
Ramsey Kenneth J.
West Bond Inc.
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