Angled pallets for wave soldering

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid

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228 43, H05K 334

Patent

active

055403760

ABSTRACT:
A pallet for holding a printed circuit board comprises first and second parallel rails and third and fourth parallel rails. The third and fourth rails each have first and second ends and form an angle of between about 30.degree. and 60.degree. with the first and second rails. The first and second ends of the third and fourth rails are connected to one of the first and second rails. The pallet further comprises an attachment for securing the printed circuit board to the third and fourth rails. The angled pallet has advantages over conventional pallets as shorts and shadowing are reduced.

REFERENCES:
patent: 5024370 (1991-06-01), Yakota
patent: 5067433 (1991-11-01), Doll, Jr. et al.
patent: 5067648 (1991-11-01), Caseini
Research Disclosure Mar. 1992 No. 335-57 Kenneth Mason Publications Ltd, England.

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