Anchoring method for flow formed integrated circuit covers

Details Anchoring method for flow formed integrated circuit covers Anchoring method for flow formed integrated circuit covers

1993-09-03

1994-08-09

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

437211, 174 522, H01L 2328, H01L 2329

Patent

active

053369319

ABSTRACT:
A flow formed encapsulated integrated circuit package (100) includes a printed circuit substrate (160) having upper and lower opposed surfaces and one or more anchor holes (150). The one or more anchor holes (150) have an upper aperture in the upper surface and a lower aperture in the lower surface. One or more integrated circuit die (130) are electrically and mechanically attached to the upper surface of the substrate (160). In addition, a solder resist mask (190) is attached to the lower surface of the substrate which covers the aperture of the one or more anchor holes (150). Flow formed material (110) is formed around the integrated circuit die (130) so as to encapsulate the one or more integrated circuits (150), the flow formed material (110) covering at a least a portion of the upper surface of the printed circuit substrate (160) and extending substantially into the anchor hole (150).

REFERENCES:
patent: 5136366 (1992-08-01), Worp

Affiliated with

Also associated with

Rating

Anchoring method for flow formed integrated circuit covers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Anchoring method for flow formed integrated circuit covers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anchoring method for flow formed integrated circuit covers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-217890