Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1995-08-15
1997-04-08
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257763, 257764, 257765, 257915, 257774, 257775, H01L 23522, H01L 23532, H01L 2941
Patent
active
056190719
ABSTRACT:
A novel high performance and reliable interconnection structure for preventing via delamination. The interconnection structure of the present invention comprises a via connection which extends into and undercuts an underlying interconnection line to lock the via connection into the interconnection line.
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Bai Peng
Charvat Peter K.
Letson Thomas A.
Myers Alan M.
Yang Shi-ning
Brown Peter Toby
Intel Corporation
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