Analyzing an electronic circuit formed upon a frontside surface

Semiconductor device manufacturing: process – With measuring or testing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438 17, 438 57, 438 72, G01R 3126, H01L 2166, H01L 2100

Patent

active

061071072

ABSTRACT:
Various methods are described for analyzing an electronic circuit formed upon a frontside surface of a semiconductor substrate having opposed frontside and backside surfaces. Each method includes forming a layer of an antireflective coating material upon the backside surface of the substrate prior to detecting electromagnetic radiation emanating from the backside surface. The layer of an antireflective coating material reduces reflections which contribute to background noise levels. As a result of reduced background noise levels, the detection capabilities of the methods and the resolutions of any scanned images produced using the methods are improved. A first method includes forming a layer of an antireflective coating material upon the backside surface of the substrate, directing a beam of electromagnetic radiation toward the backside surface of the substrate, and detecting an electrical response from the electronic circuit. A second method includes the forming of the layer of an antireflective coating material upon the backside surface of the substrate, directing the beam of electromagnetic radiation toward the backside surface of the substrate, and detecting a portion of the beam of electromagnetic radiation reflected by the electronic circuit. A third method includes forming the layer of antireflective coating material upon the backside surface of the substrate, supplying electrical power to the electronic circuit such that any crystalline defects within the electronic circuit result in the emission of electromagnetic radiation, and detecting a portion of the electromagnetic radiation exiting the semiconductor substrate through the backside surface.

REFERENCES:
patent: 4218143 (1980-08-01), Bottka
patent: 4680635 (1987-07-01), Khurana
patent: 4681449 (1987-07-01), Bloom et al.
patent: 4698587 (1987-10-01), Burns et al.
patent: 4755874 (1988-07-01), Esrig et al.
patent: 4758092 (1988-07-01), Heinrich et al.
patent: 4811090 (1989-03-01), Khurana
patent: 5164664 (1992-11-01), Soelkner
patent: 5301006 (1994-04-01), Bruce
patent: 5430305 (1995-07-01), Cole, Jr. et al.
patent: 5532873 (1996-07-01), Dixon
patent: 5631571 (1997-05-01), Spaziani et al.
patent: 5661520 (1997-08-01), Bruce
patent: 5821135 (1998-10-01), Mei et al.
Sahara et al., Electrooptic Sampling Evaluation of 1.5 um Metal-Semiconductor-Metal Photodiodes by Soliton Compressed Semiconductor Laser Pulses, IEEE Journal of Quantum Electronics, pp. 120-125, Jan. 1995.
Search Report for Application No. PCT/US 98/22023 mailed Aug. 10, 1999.
Duvillaret et al., "Absolute Voltage Measurements of III-V Integrated Circuits by Internal Electro-Optic Sampling," Electronic Letters, vol. 31, No. 1, Jan. 5, 1995, pp. 23-24.
Sahara et al., "Electrooptic Sampling Evaluation of 1.5 .mu.m Metal-Semiconductor-Metal Photodiodes by Soliton Compressed Semiconductor Laser Pulses," IEEE Journal of Quantum Electronics, vol. 31, No. 1, Jan. 1, 1995.
Annex to Form PCT/ISA/206 Communication Relating to the Results of the Partial International Search for app. No. PCT/US 98/22023 mailed Feb. 15, 1999.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Analyzing an electronic circuit formed upon a frontside surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Analyzing an electronic circuit formed upon a frontside surface , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Analyzing an electronic circuit formed upon a frontside surface will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-579756

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.