Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate
2007-12-04
2007-12-04
Deb, Anjan (Department: 2858)
Electricity: measuring and testing
Impedance, admittance or other quantities representative of...
Lumped type parameters
C324S765010, C324S525000
Reexamination Certificate
active
10850834
ABSTRACT:
A test chip performs measurements to evaluate the performances of interconnects. In particular, the statistical failure distribution, the electromigration and the leakage current are measured. An algorithm detects a via failure at any of the available n metal layers. The test chip includes a ROM memory array. The vias to be measured are formed in the columns of the array. Via or contact failures are detected by forcing a predetermined current through both an array column and a reference column. The failure analysis is obtained by comparing the resulting voltage drops.
REFERENCES:
patent: 5811977 (1998-09-01), Rouchard
patent: 5844850 (1998-12-01), Tsutsui et al.
patent: 6175125 (2001-01-01), Tsai
patent: 6475871 (2002-11-01), Stine et al.
patent: 6704609 (2004-03-01), Shen
patent: 6933730 (2005-08-01), Parker et al.
patent: 6948105 (2005-09-01), Rajsuman
patent: 2005/0257086 (2005-11-01), Triou et al.
patent: 2006/0022678 (2006-02-01), Hegazy et al.
patent: 200305121 (2003-02-01), None
patent: 03/012857 (2003-02-01), None
Cappelletti Paolo
Maurelli Alfonso
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Deb Anjan
Jorgenson Lisa K.
STMicroelectronics S.r.l.
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