Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Reexamination Certificate
2005-08-09
2005-08-09
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
C204S229800, C205S084000, C700S121000, C716S030000
Reexamination Certificate
active
06926816
ABSTRACT:
The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process.On the circuit pattern of a printed circuit board, in the method for analyzing the thickness distribution of metal film plated selectively, hypothetically dividing the printed circuit board into one or more regions, introducing pattern density θj=Aj/Sj (Sj: the area Sj of a desired region j, and Aj: the area of the plated surface inside the area j), and calculating the approximate average current density or film thickness distribution based on “approximation averaged by pattern density”.
REFERENCES:
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patent: 5084153 (1992-01-01), Mosse et al.
patent: 6542784 (2003-04-01), Amaya et al.
patent: 6565729 (2003-05-01), Chen et al.
U.S. Appl. No. 10/067,214, filed Feb. 7, 2002; entitled: “Semiconductor device and method of manufacturing the same”.
U.S. Appl. No. 09/545,093, filed Apr. 7, 2000, entitled “Plating method, plating solution, semiconductor device and process for producing the same”.
Kobayashi Kinya
Sano Akihiro
Crowell & Moring LLP
Hitachi , Ltd.
King Roy
Leader William T.
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