Amplifiers – Involving structure other than that of transformers per se – With printed circuits
Patent
1984-06-15
1986-09-16
LaRoche, Eugene R.
Amplifiers
Involving structure other than that of transformers per se
With printed circuits
330 53, 330151, 330286, H03F 360
Patent
active
046125124
ABSTRACT:
A packaging technique for radio-frequency circuits, such as feed-forward amplifiers, in which a single ground plane is formed between active components of the circuit and a circuit board bearing passive components of the circuit. The ground plane comprises a metallized face of the circuit board and a metal heat sink attached to each active component. The assembly, including the circuit board, heat sinks and active and passive components, is supported on a ledge in the walls of a metal housing, such that heat is conducted laterally through the ground plane and directly into the walls of the housing. The walls of the housing, including an intermediate wall between active amplifier components, also serve to isolate the active components from each other and from the environment. The plane also serves to isolate the active components from the passive ones.
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Liatsos Charles E.
Powell Jack
Heal Noel F.
LaRoche Eugene R.
Mottola Steven J.
Nyhagen Donald R.
TRW Inc.
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