Amorphous silicon film forming apparatus

Coating apparatus – Gas or vapor deposition – Multizone chamber

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118723, 118 501, C23C 1308

Patent

active

046338098

ABSTRACT:
An amorphous silicon film forming apparatus forms an amorphous silicon film on a substrate. The apparatus is provided with a sealed vessel whose inside space is defined as a reaction chamber. A gas inlet pipe for introducing a gas containing SiH4 into the reaction chamber is connected to the vessel. A facing electrode provided in the reaction chamber and a power source connected to the facing electrode convert in a plasma generating region the gas introduced into the reaction chamber by the gas inlet pipe into plasma. A conductive mesh structure is disposed in the reaction chamber so as to surround the plasma generating region.

REFERENCES:
patent: 4064521 (1977-12-01), Carlson
patent: 4173661 (1979-11-01), Bourdon
patent: 4225222 (1980-09-01), Kempter et al.
patent: 4298443 (1981-11-01), Maydan
patent: 4317844 (1982-02-01), Carlson
patent: 4379943 (1983-04-01), Yang et al.
patent: 4400410 (1983-08-01), Green et al.
patent: 4404076 (1983-09-01), Nakagawa et al.
patent: 4418645 (1983-12-01), Knights et al.
patent: 4438188 (1984-03-01), Shimatani et al.
patent: 4450787 (1984-05-01), Weakliem et al.
patent: 4461239 (1984-07-01), Cannella et al.
patent: 4478173 (1984-10-01), Doehler
Page 216 of Encyclopedia Chimica.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Amorphous silicon film forming apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Amorphous silicon film forming apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Amorphous silicon film forming apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-676360

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.