Amorphous hydrogenated carbon hermetic structure and fabrication

Details Amorphous hydrogenated carbon hermetic structure and fabrication Amorphous hydrogenated carbon hermetic structure and fabrication

1997-07-28

2000-11-21

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257751, 257790, 257687, 257701, 257702, 257632, 257636, H01L 2348, H01L 2352, H01L 2940

Patent

active

061507199

ABSTRACT:
A hard layer of amorphous hydrogenated carbon (DLC) overlies a polymer film structure and a plurality of soft layers of DLC alternate with a plurality of hard layers of DLC over the barrier base to form a corrosion resistant structure. The polymer film structure and a circuit chip can be elements of a circuit module. The DLC and the polymer film structure can have vias extending to contact pads, and a pattern of electrical conductors can extend through the vias to the contact pads. In one embodiment the DLC forms a hermetic (and therefore corrosion resistant) seal over the polymer film structure.

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U.S. Patent Application, "Structure And Fabri Cation Method For Thin Film Capacitors" By R.J. Saia, Et Al No. 08/566,616 filed Dec. 4, 1995. Now U.S. Ser. No. 5736448 Apr. 7, 1998.

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