Ammonium ions used as electroless copper plating rate controller

Details Ammonium ions used as electroless copper plating rate controller Ammonium ions used as electroless copper plating rate controller

1982-09-02

1984-05-22

Smith, John D.

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

106 123, 106 126, 427305, 427437, C23C 302

Patent

active

044501919

ABSTRACT:
A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.

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Arcilesi, "Improvements in Electroless Copper for Automotive Plastic Trim", Plating, & Surface Finishing, p. 90, Jun. 1981.
Saybestre, "Stabilizing Electroless Copper Solutions" Plating, pp. 563-566, Jun. 1972.
Saybestre, "Electroless Copper Plating" 46th Annual Technical Proceedings, American Electroplaters' Society, pp. 264-276.

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