Ammonia free palladium electroplating bath using aminoacetic aci

Details Ammonia free palladium electroplating bath using aminoacetic aci Ammonia free palladium electroplating bath using aminoacetic aci

1979-01-12

1980-12-30

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 47, C25D 352

Patent

active

042421802

ABSTRACT:
An aqueous ammonia-free bath for galvanic deposition of palladium or palladium alloys and a process for using involving the use of aminoacetic acid as the sole complexing agent for palladium or palladium alloys in ammonium free, alkaline aqueous media.

REFERENCES:
patent: 3376206 (1968-04-01), Kahan et al.
patent: 3458409 (1969-07-01), Hayashi et al.
patent: 3933602 (1976-01-01), Henzi et al.
patent: 4144141 (1979-03-01), Schuster et al.
O. V. Izbekova et al., Zashchita Metallov, vol. 9, No. 1, pp. 108-110, (1973).
Chemical Abstracts, vol. 78, 118401v, p. 505, (1973).
Chemical Abstracts, vol. 80, 115390w, p. 503, (1974).

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