Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2002-07-08
2008-07-01
Webb, Gregory E (Department: 1796)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S201000
Reexamination Certificate
active
07393819
ABSTRACT:
Ammonia-free cleaning compositions for cleaning microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous, low-κ and high-κ dielectrics and copper metallization. Cleaning compositions for stripping photoresists, cleaning residues from plasma generated organic, organometallic and inorganic compounds, and cleaning residues from planarization processes. The cleaning composition contain one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions and one or more steric hindered amide solvents.
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Patent Abstracts of Japan, vol. 2000, No. 16, May 8, 2001 of JP 2001 005201, Jan. 12, 2001.
Mallinckrodt Baker Inc.
Ohlandt Greeley Ruggiero & Perle
Rouchfuss, Jr. George W.
Webb Gregory E
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