Amide-substituted silicones and methods for their...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From silicon reactant having at least one...

Reexamination Certificate

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C528S031000, C554S068000

Reexamination Certificate

active

07956150

ABSTRACT:
A composition includes: (A) an amide-substituted silicone and (B) a thermally conductive filler. The composition may be used as a thermal interface material for dissipating heat from electronic devices.

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Abstract for JP 5-209130.
Abstract for 7-196671.
Machine-generated translation of JP 7-196671.
Zweifel, Hans, “Effect of Stabilization of Polypropylene During Processing and Its Influence on Long-Term Behavior under Thermal Stress,” Polymer Durability, American Chemical Society, vol. 24, pp. 375-396, 1996.

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