Ambient plasma treatment of printer components

Details Ambient plasma treatment of printer components Ambient plasma treatment of printer components

2007-10-17

2011-10-04

Stephens, Juanita D (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S044000, C347S047000

Reexamination Certificate

active

08029105

ABSTRACT:
A method of treating a printer component, a printhead, and a printer are provided. The method includes providing an electrode proximate to the printer component to be treated; introducing a plasma treatment gas in an area proximate to the printer component to be treated; and treating the printer component by applying power to the electrode thereby producing a micro-scale plasma at near atmospheric pressure, the micro-scale plasma acting on the printer component.

REFERENCES:
patent: 3705055 (1972-12-01), Christensen et al.
patent: 3875068 (1975-04-01), Mitzel
patent: 3879597 (1975-04-01), Bersin et al.
patent: 4088926 (1978-05-01), Fletcher et al.
patent: 4472467 (1984-09-01), Tamaki et al.
patent: 4717631 (1988-01-01), Kaganowicz
patent: 4719477 (1988-01-01), Hess
patent: 4740410 (1988-04-01), Muller et al.
patent: 5124173 (1992-06-01), Uchiyama et al.
patent: 5136310 (1992-08-01), Drews
patent: 5202705 (1993-04-01), Asano et al.
patent: 5218381 (1993-06-01), Narang et al.
patent: 5414324 (1995-05-01), Roth et al.
patent: 5425980 (1995-06-01), Grace et al.
patent: 5514936 (1996-05-01), Williamson et al.
patent: 5576076 (1996-11-01), Slootman et al.
patent: 5610335 (1997-03-01), Shaw et al.
patent: 5714308 (1998-02-01), Romach et al.
patent: 5790146 (1998-08-01), Anderson
patent: 5942855 (1999-08-01), Hopwood
patent: 5961772 (1999-10-01), Selwyn
patent: 6082292 (2000-07-01), Denes et al.
patent: 6127198 (2000-10-01), Coleman et al.
patent: 6193352 (2001-02-01), Sharma et al.
patent: 6243112 (2001-06-01), Kuhman et al.
patent: 6325490 (2001-12-01), Yang et al.
patent: 6399159 (2002-06-01), Grace et al.
patent: 6444275 (2002-09-01), Kuhman
patent: 6488357 (2002-12-01), Skinner et al.
patent: 6517187 (2003-02-01), Dietl
patent: 6603121 (2003-08-01), Grace et al.
patent: 6666449 (2003-12-01), DeFosse et al.
patent: 6695664 (2004-02-01), Eden et al.
patent: 6726304 (2004-04-01), Fassler et al.
patent: 6827870 (2004-12-01), Gianchandani et al.
patent: 6926394 (2005-08-01), Bowling
patent: 7041608 (2006-05-01), Sieber et al.
patent: 7172267 (2007-02-01), Furukawa
patent: 7516549 (2009-04-01), Asuke
patent: 2002/0022139 (2002-02-01), Kotera et al.
patent: 2002/0113553 (2002-08-01), Vojak et al.
patent: 2003/0132693 (2003-07-01), Eden et al.
patent: 2004/0144733 (2004-07-01), Cooper et al.
patent: 2004/0164682 (2004-08-01), Hopwood et al.
patent: 2005/0168527 (2005-08-01), Miyakawa et al.
patent: 2005/0185016 (2005-08-01), Mori et al.
patent: 2006/0028145 (2006-02-01), Mohamed et al.
patent: 2006/0132541 (2006-06-01), Nishijima
patent: 2006/0221144 (2006-10-01), Nagashima
patent: 2007/0029500 (2007-02-01), Coulombe et al.
patent: 1 306 214 (2009-03-01), None
patent: 60-204372 (1985-10-01), None
Martinu et al., “Plasma Deposition of Optical Films and Coatings: A Review”,J. Cac. Sci. Technol.A 18(6), Nov./Dec. 2000.
Bardos et al., “Characterization of Hybrid Atmospheric Plasma in Air and Nitrogen”,Vacuum Technology&Coating7(12) 44-47 (2006).
Lieberman et al.,Principles of Plasma Discharges and Materials Processing, John Wiley & Sons, Inc., New York (1994).
Stoffels et al., “Superficial Treatment of Mammalian Cells Using Plasma Needle”,J. Phys. D: Appl. Phys. 36 (2003) 2908-2913.
F. M. Penning,Electrical Discharges in Gases, Gordon and Breach, New York 1965.

Affiliated with

Also associated with

Rating

Ambient plasma treatment of printer components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ambient plasma treatment of printer components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ambient plasma treatment of printer components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4285285