Amalgam preform, method of forming the preform and method of bon

Alloys or metallic compositions – Mercury base

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420527, C22C 700

Patent

active

050431390

ABSTRACT:
The present invention relates to a preform of a solid body of an amalgam. The amalgam is a mixture of a metal which is liquid at room temperature and at least one powdered metal. The preform is formed by mixing together the ingredients of the amalgam and pouring the amalgam into a caity in a mold. The mold and amalgam is then cooled to a temperature below the melting temperature of the liquid metal in the amalgam. The preform is then removed from the mold. The preform can be stored at the low temperature until it is desired to use it to bond two bodies together. The preform can be used to bond two bodies together, such as the cover plate and housing of a microelectronic device package, by placing the preform between the two bodies. The bodies are mechanically scrubbed and clamped together with the preform therebetween and heated to a temperature at which the preform melts and the amalgam reacts to bond to the two bodies. Since the liquid metal in the amalgam has a melting temperature slightly above normal room temperature, the bonding can be achieved at relatively low temperatures.

REFERENCES:
patent: 4664629 (1987-05-01), Chodkowski

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