Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1977-01-21
1978-04-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
134 2, 156219, 204 58, B32B 3100
Patent
active
040861147
ABSTRACT:
A thin sheet of electrical grade aluminum is secured to a thin substrate sheet of epoxy/fiberglass or polyimide/fiberglass to form a multilayer card. This card is processed by printed circuit techniques to form the electrical circuit pattern of a printed circuit motor armature. The surface of the aluminum sheet which confronts the substrate sheet is processed in a manner to have a continuous pattern of oblong depressions generally normal to the surface. The major axes of these depressions are generally aligned with each other, and define the direction of the higher adhesion strength. The major axes of these depressions are in alignment with the direction of the electrical conductors constituting the armature circuit pattern. The aluminum surface, containing these depressions, includes a thin, clear, continuous unsealed anodized coating.
REFERENCES:
patent: 3249958 (1966-05-01), Haracz
patent: 3498870 (1970-03-01), Fritchey
patent: 3674619 (1972-07-01), Scher et al.
patent: 3891516 (1975-06-01), Chu
patent: 3928527 (1975-12-01), Wohnhaas et al.
patent: 3935080 (1976-01-01), Gumbinner et al.
patent: 4011150 (1977-03-01), Peterson
Cockburn Joscelyn G.
International Business Machines - Corporation
Massie Jerome W.
Powell William A.
LandOfFree
Aluminum surface treatment to enhance adhesion in a given direct does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Aluminum surface treatment to enhance adhesion in a given direct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminum surface treatment to enhance adhesion in a given direct will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2419671