Aluminum substrate for lithographic printing plate and process f

Details Aluminum substrate for lithographic printing plate and process f Aluminum substrate for lithographic printing plate and process f

1998-03-12

2000-12-05

Wyszomierski, George

Metal treatment

Process of modifying or maintaining internal physical...

With casting or solidifying from melt

148552, 148692, 148437, 101459, B41N 300, C22F 104

Patent

active

061561355

ABSTRACT:
An aluminum substrate for lithographic printing plates which forms uniform pits on electrolytic etching without undergoing dissolution, the substrate being obtained by electrolytic etching an aluminum plate prepared by continuous casting in a twin roll mold process, rolling, and annealing, in which the annealing is carried out in such a manner that the resulting aluminum plate may have a total electric current density of not more than 1.85.times.10.sup.-2 C/dm.sup.2 when scanned at a potential from -100 mV up to 1500 mV.

REFERENCES:
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patent: 5350010 (1994-09-01), Sawada et al.
patent: 5456772 (1995-10-01), Matsuki et al.
patent: 5462614 (1995-10-01), Sawada et al.
patent: 5507887 (1996-04-01), Uesugi et al.
patent: 5525168 (1996-06-01), Sawada et al.
patent: 5711827 (1998-01-01), Sawada et al.

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