Aluminum-refractory metal interconnect with anodized periphery

Details Aluminum-refractory metal interconnect with anodized periphery Aluminum-refractory metal interconnect with anodized periphery

1984-02-21

1985-07-23

James, Andrew J.

357 67, 357 65, H01H 2348, H01H 2946

Patent

active

045311447

ABSTRACT:
A metal interconnect structure for an integrated circuit with a layer of refractory metal over the structure to prevent formation of hillocks, thereby eliminating a hard anodization step. The refractory metal may be tantalum, titanium-tungsten alloys, hafnium, or other refractory metals which form insulating anodic oxides.

REFERENCES:
patent: 3654526 (1972-04-01), Cunningham et al.
patent: 3939047 (1976-02-01), Tsunemitsu et al.
patent: 4001871 (1977-01-01), Tsunemitsu

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