Aluminum plug process

Details Aluminum plug process Aluminum plug process

1993-08-19

1994-10-18

Quach, T. N.

Fishing, trapping, and vermin destroying

437190, 437192, 437195, H01L 21283

Patent

active

053568362

ABSTRACT:
A new method of metallization of an integrated circuit is described. This method can be used for a first metallization to contact the semiconductor substrate regions or for a subsequent metallizations for interconnection within the integrated circuit. An insulating layer is provided over the surface of a semiconductor substrate or over a metallization layer. At least one contact opening is made through the insulating layer to the semiconductor substrate or to the metallization layer. A barrier metal layer is deposited over the surface of the substrate and within the contact opening wherein most of the barrier metal is deposited on the bottom of the contact opening rather than on the sides of the opening. A metal layer is cold sputtered over the barrier metal layer, then the metal is hot sputtered over the cold-sputtered metal layer wherein the cold and hot sputtering are continuous operations to complete the metallization of the integrated circuit.

REFERENCES:
patent: 4837183 (1989-06-01), Polito et al.
patent: 4960732 (1990-10-01), Dixit et al.
patent: 4994162 (1991-02-01), Armstrong et al.
patent: 5007372 (1991-04-01), Hattori et al.
patent: 5106781 (1992-04-01), Penning DeVries
patent: 5108951 (1992-04-01), Chen et al.
patent: 5240880 (1993-08-01), Hindman et al.

Affiliated with

Also associated with

Rating

Aluminum plug process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aluminum plug process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminum plug process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2372111