Aluminum nitride substrate

Details Aluminum nitride substrate Aluminum nitride substrate

1987-02-20

1988-08-02

Terapane, John F.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428555, 428620, 428627, 357 80, 148DIG113, B22F 702

Patent

active

047613459

ABSTRACT:
There is disclosed an aluminum nitride substrate which comprises a substrate composed of an aluminum nitride sintered product; an electroconductive metallized layer composed of titanium nitride and at least one selected from the group consisting of molybdenum, tungsten, tantalum, an element in group III of the periodic table, an element in group IVa of the same, a rare earth element, an actinide element and a compound containing these elements; and an electroconductive protective layer laminated in this order on the aluminum nitride sintered product.

REFERENCES:
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4570328 (1986-02-01), Price et al.
patent: 4585706 (1986-04-01), Takeda et al.
patent: 4610933 (1986-09-01), Van de Leest
patent: 4656101 (1987-04-01), Yamazaki
patent: 4659611 (1987-04-01), Iwase et al.

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