Aluminum nitride sintered compact

Details Aluminum nitride sintered compact Aluminum nitride sintered compact

2003-07-30

2009-11-24

McNeil, Jennifer (Department: 1794)

Stock material or miscellaneous articles

Composite

Of inorganic material

Reexamination Certificate

active

07622203

ABSTRACT:
Provided is an aluminum nitride sintered body having a larger area and a smaller thickness as compared to the conventional art, wherein the aluminum nitride sintered body has flatness with controlled warpage and/or waviness height. Methods of producing such sintered body, and further a metallized substrate and a heater using such sintered body are also provided. An aluminum nitride substrate1has a maximum length of 320 mm or more, a thickness of more than 0 mm and 2 mm or less, a warpage of 0 μm/mm or more and less than 2 μm/mm, and a local waviness height of 0 μm or more and 100 μm or less.

REFERENCES:
patent: 5732318 (1998-03-01), Natsuhara et al.
patent: 1130607 (1996-09-01), None
patent: 1 142 849 (2001-10-01), None
patent: 1-282157 (1989-11-01), None
patent: 2-302088 (1990-12-01), None
patent: 11-174875 (1999-07-01), None
patent: 2002-68849 (2002-03-01), None
European Search Report issued in European Patent Application No. EP 03 78 8020, mailed Oct. 29, 2008.
Office Action, Mar. 17, 2006.

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