Aluminum nitride sintered body with high thermal conductivity an

Details Aluminum nitride sintered body with high thermal conductivity an Aluminum nitride sintered body with high thermal conductivity an

1989-09-11

1990-10-09

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428688, 428698, 428699, 428704, 428901, 361397, 361414, B32B 900

Patent

active

049619870

ABSTRACT:
AlN-base sintered body with a high thermal conductivity is produced by:
preparing a compact of a material comprising 100 parts by weight of aluminum nitride and 0.1-10 parts by weight, calculated on metal element, of at least one component selected from the group consisting of elements of Group 4a, 5a and 6a of the Periodic Table, and compounds thereof; and
sintering said compact at a temperature ranging from 1500.degree. to 2000.degree. C. under a non-oxidizing atmosphere having a source of boron and/or carbon supply. The compounds include oxides, borides, nitrides and carbides. The elements include W, Mo, Ta and Ti. Oxides are converted to other compounds through sintering. This AlN-base sintered body has good wettability with metal for metallization and enables simultaneous sintering with metallization layer. Multilayer laminated circuit boards or substrates thereof can be produced.

REFERENCES:
patent: 3649314 (1972-03-01), James
patent: 3676161 (1972-07-01), Yates
patent: 4435513 (1984-03-01), Komeya et al.
patent: 4591537 (1986-05-01), Aldinger et al.

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