Aluminum nitride sintered body and substrate for electronic...

Details Aluminum nitride sintered body and substrate for electronic... Aluminum nitride sintered body and substrate for electronic...

2005-10-11

2005-10-11

Group, Karl (Department: 1755)

Compositions: ceramic

Ceramic compositions

Refractory

C428S469000, C428S698000

Reexamination Certificate

active

06953761

ABSTRACT:
An aluminum nitride sintered body produced by sintering under pressure of a powder composition comprising aluminum nitride and 5 to 30% by weight of at least one sintering aid selected from the group consisting of Nd, Sm, Eu, Er, Dy, Gd, Pr and Yb, per 100% by weight of the powders of aluminum nitride and the sintering aid, wherein the amount of the sintering aid is a conversion value as oxides of the elements, the sintering body that has been subjected to mirror-polishing having a surface roughness R max of 0.2 μm or less and a thermal conductivity of 200 (W/mK) or more.

REFERENCES:
patent: 6174614 (2001-01-01), Yushio et al.
patent: 6689498 (2004-02-01), Shinosawa et al.
patent: 6800576 (2004-10-01), Katsuda et al.
patent: 61-216243 (1986-09-01), None
patent: 02-038368 (1990-02-01), None
patent: 02-092869 (1990-04-01), None
patent: 05-058744 (1993-03-01), None
patent: 07-069732 (1995-03-01), None
patent: 08-157264 (1996-06-01), None
patent: 11-092229 (1999-04-01), None
patent: 2002-097075 (2002-04-01), None

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