Aluminum nitride sintered body

Details Aluminum nitride sintered body Aluminum nitride sintered body

2008-03-11

2008-03-11

Group, Karl E (Department: 1793)

Compositions: ceramic

Ceramic compositions

Refractory

C219S553000

Reexamination Certificate

active

11234765

ABSTRACT:
The object of the present invention is to provide a susceptor with superior thermal uniformity by minimizing pores in an aluminum nitride sintered body.In an aluminum nitride sintered body according to the present invention, the tin content and sulfur content are controlled so that they are no more than a fixed amount. More specifically, in an aluminum nitride sintered body having as its main component aluminum nitride, the tin content in the aluminum nitride sintered body is no more than 50 ppm and the sulfur content is no more than 100 ppm. It would be preferable for a resistance heating body to be formed in the aluminum nitride sintered body and it would be preferable for the aluminum nitride sintered body to be used as a semiconductor heating unit.

REFERENCES:
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patent: 6486085 (2002-11-01), Katsuda et al.
patent: 6800576 (2004-10-01), Katsuda et al.
patent: 7081425 (2006-07-01), Kanechika et al.
patent: 2-26871 (1990-01-01), None
patent: 11-074064 (1999-03-01), None
patent: 2003292377 (2003-10-01), None
patent: 2005119953 (2005-05-01), None
Patent Abstracts of Japan for JP11-074064 published Mar. 16, 1999.

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