Aluminum nitride multi-chip module

Details Aluminum nitride multi-chip module Aluminum nitride multi-chip module

1991-05-15

1992-10-13

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 803, 174252, 357 81, 361413, H05K 720

Patent

active

051556618

ABSTRACT:
A multi-chip module is configured using an aluminum nitride, or AlN, multi-chip substrate, sandwiched chip side down under an extruded aluminum convection cooled heat sink. An alignment ring includes grooves for control of z-axis elastomeric conductors slightly compressed between the chip connection surface of the substrate and the top surface of a PCB to provide the interconnections therebetween. The alignment ring includes a stopper portion which controls the height of the heat sink above the PCB as well as a smaller rail portion which controls the height of the substrate above the PCB. The good thermal conductivity, ruggedness and relatively good TCE match of the AlN substrate to the silicon chips permits a convenient, dense and thermally rugged MCM.

REFERENCES:
patent: 4509099 (1985-04-01), Takamatsu
patent: 4533976 (1985-08-01), Suwa
patent: 4961987 (1990-10-01), Okuno
patent: 5027191 (1991-06-01), Bourdelaise
patent: 5041700 (1991-08-01), Iyosi
patent: 5055914 (1991-10-01), Shimizu

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