Aluminum nitride conjugate body and method of producing the...

Stock material or miscellaneous articles – Composite – Of inorganic material

Reexamination Certificate

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C428S209000, C428S304400, C428S689000, C428S469000, C279S128000, C156S089270, C361S234000, C029S832000, C029S525140, C029S525150

Reexamination Certificate

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07488543

ABSTRACT:
An aluminum nitride joined body comprising two pieces of aluminum nitride sintered body plates joined together without using adhesive, and a metal layer formed on a portion of the junction interface thereof, wherein, as viewed on a side section passing through the center of the joined body, a plurality of voids are existing in the directly joined region where the sintered body plates are directly facing each other on the junction interface, the voids having an average length L of 0.5 to 4 μm along the junction interface, thereby forming non-joined portions due to the voids, and a non-joined ratio Q on the side section as calculated by the following formula (1),in-line-formulae description="In-line Formulae" end="lead"?Non-joined ratioQ=(X/Y)×100  (1)in-line-formulae description="In-line Formulae" end="tail"?where X is a length of the non-joined portion in the direction of junction interface expressed by the sum of lengths L of the voids existing in the directly joined region, and Y is a length of the directly joined region where the voids are existing,is in a range of from 0.1 to 0.5% on average. The AlN plate-like joined body has the metal layer contained therein that is effectively suppressed from warping, exhibits a large junction strength, excellent durability, and is useful as a plate heater or an electrostatic chuck for treating a semiconductor wafer that is placed thereon in an apparatus for producing a semiconductor.

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