Aluminum nitride circuit substrate

Details Aluminum nitride circuit substrate Aluminum nitride circuit substrate

1987-07-08

1989-10-10

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428662, 428663, 428665, 428674, 428680, 428901, 357 71, B32B 1504

Patent

active

048731510

ABSTRACT:
Disclosed is an aluminum nitride circuit substrate comprising an aluminum nitride plate and a conductive material bonded to the aluminum nitride plate through a metallized layer formed on the bonding surface of the aluminum nitride plate, the conductive material being of a metallic material which has a thermal expansion coefficient of 2.times.10.sup.-6 to 6.times.10.sup.-6 /.degree.C.
The aluminum nitride circuit substrate according to this invention is free from the generation of crack caused by the difference of the thermal expansion coefficients of AlN plate and a conductive material bonded to the AlN plate to improve the reliability of the elements.

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W. Werdecker, 35th Electronic Components Conference, "High Performance aluminum nitride substrate by tape casting technology", pp. 26-31, IEEE, May 20-22, 1985.
H. Takashio "Alumina Ceramic-to-Metal Seals by the Mo-Mn Process" Yogyo-Kyokai-Shi, 79(9)1971, pp. 330-339.

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