Aluminum nitride circuit board and method of producing same

Details Aluminum nitride circuit board and method of producing same Aluminum nitride circuit board and method of producing same

1993-09-03

1995-11-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174257, 174258, 174262, H05K 100

Patent

active

054649501

ABSTRACT:
An aluminum nitride circuit board includes an aluminum nitride ceramic body. An inner conductor metal which is to be used as a wiring material is formed in the aluminum nitride ceramic body. The inner conductor metal is mainly made of copper, a melting point of which is lower than a firing temperature of the aluminum nitride ceramic. A layer mainly made of a periodic table IVa group metal or compound, such as titanium, zirconium, or hafnium, is formed in an interface between the aluminum nitride ceramic body and the inner conductor metal.

REFERENCES:
patent: 4906404 (1990-03-01), Suehiro et al.
patent: 5229213 (1993-07-01), Horiuchi et al.
Patent Abstracts Of Japan, vol. 12, No. 219 (C-506), Jun. 22, 1988 & JP-A-63 015866 (Copal Co Ltd), Jan. 22, 1988.
Patent Abstracts Of Japan, vol. 14, No. 414 (E-0975), Sep. 7, 1990 & JP-A-02 159096 (Fujitsu Ltd), Jun. 19, 1990.
Patent Abstracts Of Japan, vol. 16, No. 23 (E-1157), Jan. 21, 1992 & JP-A-03 240289 (Fujitsu Ltd), Oct. 25, 1991.
Patent Abstracts Of Japan, vol. 16, No. 97 (E-1176), Mar. 10, 1992 & JP-A-03 276797 (Fujitsu Ltd), Dec. 6, 1991.
Patent Abstracts Of Japan, vol. 16, No. 196 (E-1200), May 12, 1992 & JP-A-04 028294 (Ibiden Co Ltd), Jan. 30, 1992.
Patent Abstracts Of Japan, vol. 16, No. 372 (E-1246), Aug. 11, 1992 & JP-A-04 118990 (Fujitsu Ltd), Apr. 20, 1992.
Database WPI, Week 8847, Derwent Publications Ltd., London, GB; AN 88-332648 & JP-A-63 244521 (Murata Mfg Co), Oct. 12, 1988.
Database WPI, Week 9115, Derwent Publications Ltd., London, GB; AN 91-105450 & JP-A-03 046705 (Showa Denko KK), Feb. 28, 1991.
Iwase et al., "Aluminum Nitride Multi-Layer Pin Grid Array Packages," Proceeding Of 37th Electronic Components Conference, May 11-13, 1987, Boston, pp. 384-391.
A. H. Carim, "High-Resolution Electron Microscopy of Interfaces in AlN-Braze Metal Alloy Systems," Material Research Society Symposium Proceeding, vol. 159, 1990, pp. 425-430.
Anderson et al., "Brazing of Aluminum Nitride," The International Journal For Hybrid Microelectronics, vol. 14, No. 4, Dec. 1991, pp. 121-128.
Taniguchi Yoshiaki, Patent Abstracts of Japan, "Electrically Conductive Composition For Thick-Film Paste" vol. 012, No. 219, Jun. 22, 1988.
Database WPI, "Conductive Paste Made Of Sintered Aluminum Nitride--Contains Tungsten Or Molybdenum With Oxide(s) Of Calcium, Barium, Strontium, Titanium, Niobium And/Or Rare Earth Metal", Week 8847, Derwent Publications Ltd., London, GB.
Database WPI, "Copper Paste For Printed Circuit Boards--Prepared By Kneading Solid Component Contg. Glass Powder With Vehicle Component And Copper Powder For Improved Attached Strength", Week 9115, Derwent Publications Ltd., London, GB.
Omote Koji et al., Patent Abstracts of Japan, "Manufacture Of Aluminum Nitride Board", vol. 016, No. 097, Jan. 1992.
Suzuki Takahiko et al., Patent Abstracts of Japan, "Manufacture Of Aluminum Nitride Substrate", vol. 015, No. 023, Jan. 1992.

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