Aluminum nitride circuit board

Stock material or miscellaneous articles – Composite – Of metal

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428688, 428901, B32B 1504

Patent

active

052292134

ABSTRACT:
An aluminum nitride circuit board included an aluminum nitride ceramic as an insulating material and a conductor circuit which is formed at least as an inner conductor and is made of at least one of gold, copper or silver.

REFERENCES:
patent: 4770953 (1988-09-01), Horiguchi et al.
patent: 4869925 (1989-09-01), Hiai et al.
patent: 4906511 (1990-03-01), Sato et al.
patent: 4961987 (1990-10-01), Okuno et al.
N. Iwase et al., "Aluminum Nitride Multi-Layer Pin Grid Array Packages", proceedings Electro. Comp. Conf. pp. 384-391, Boston (1987).
H. Mandai et al, "A Low Temperature Cofired Multilayer Ceramic Substrate Containing Copper Conductors", proceedings Int. Microelec. Conf. pp. 61-64 Kobe (1986).
T. Nishimura et al., "Co-Fireable Copper Multilayered Ceramic Substrate", ibid pp. 249-254 Kobe (1986).
K. Allison et al., "Thick Film Materials for Applications on Aluminum Nitride Substrates", ibid pp. 153-160, Tokyo (1988).

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