Aluminum nitride ceramics and method for preparing the same

Details Aluminum nitride ceramics and method for preparing the same Aluminum nitride ceramics and method for preparing the same

1996-08-15

1997-10-14

Turner, Archene

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

1741264, 174137B, 174138C, 428212, 428148, 428156, 428432, 428457, 428469, 428698, 428701, C04B 3558, H05K 103

Patent

active

056770529

ABSTRACT:
Aluminium nitride ceramics improved in heat radiation property used as a substrate for integrated circuits and package material, comprising a sintered article consisting mainly of aluminium nitride and having a thermal conductivity higher than 100.multidot.W/m.multidot.K at room temperature and a surface layer consisting mainly of aluminium nitride or oxide glass deposited on the sintered article.
A paste of aluminium nitride powder or oxide glass powder is coated on a surface of the sintered article of aluminium nitride and then is sintered to prepare a dense smooth surface layer.

REFERENCES:
patent: 4756976 (1988-07-01), Komeya et al.
patent: 4775596 (1988-10-01), Holleran et al.
patent: 4840853 (1989-06-01), Iio et al.
English transaction of JP 63-1902075.
English translation of JP 63-170289.
Yoneda et al "Preparation of High Thermal Conductivity ALN ceramics & Metallization" IMC 1988 May 25-27, pp. 147-152.

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