Aluminum nitride ceramic substrate for copper and method for pro

Details Aluminum nitride ceramic substrate for copper and method for pro Aluminum nitride ceramic substrate for copper and method for pro

1988-06-28

1989-09-05

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 57, 264 58, 264 67, C04B 3558

Patent

active

048636584

ABSTRACT:
When molded plates of aluminum nitride obtained by molding a ceramic powder formed preponderantly of aluminum nitride powder are superposed on a support base with a ceramic powder interposed between the support base and the superposed plates and between the superposed plates and are fired in a non-oxidative atmosphere, the sintered plates consequently produced are prevented from sustaining crack or fracture.
When warped and undulated sintered plates of aluminum nitride are superposed on a support base with a ceramic powder interposed between the support base and the superposed plates and between the superposed plates and are heated in a non-oxidative atmosphere, the heated plates are relieved of warp and undulation.
The sintered plates of aluminum nitride are enabled to acquire improved adhesiveness to a metal film or foil when they are subjected to a heat treatment adapted to reduce the surface roughness to or below 10 .mu.m (Rmax).

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