Aluminum metallization for semiconductor devices

Details Aluminum metallization for semiconductor devices Aluminum metallization for semiconductor devices

1989-10-25

1990-12-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437198, 437199, H01L 2144

Patent

active

049753894

ABSTRACT:
Stress induced grain boundary movement in aluminum lines used as connections in integrated circuits is substantially avoided by doping the aluminum with iron. Through this expedient not only is grain boundary movemenmt avoided but electromigration problems are also decreased.

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patent: 4845543 (1989-07-01), Akikawa
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R. J. Schutz in VLSI Technology, S. M. Sze, ed., McGraw-Hill Book Company, New York, second edition, 1988, p. 197.
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