Aluminum interconnection

Details Aluminum interconnection Aluminum interconnection

1995-06-06

1998-06-02

Niebling, John

Fishing, trapping, and vermin destroying

437194, 437245, 427 61, 427 96, H01L 21441

Patent

active

057598681

ABSTRACT:
An aluminum interconnection of the invention contains scandium as an impurity, so that the hardness of the interconnection is improved. Moreover, after a thin Al--Sc alloy film is formed, an annealing is performed so as to make the crystal grain larger than the width of the interconnection. The resulting Al interconnection has a high resistance against a stressmigration or electromigration, when a current stress is applied at a practical temperature in an LSI. This greatly contributes to the fabrication of a semiconductor device having a fine structure.

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patent: 5036382 (1991-07-01), Yamaha
patent: 5453402 (1995-09-01), Cheung et al.
patent: 5541007 (1996-07-01), Ueda et al.
Mayumi et al, "The Effect of Cu Addition to Al-Si Interconnects on Stress Induced Open-Circuit Failures". IEEE/IRPS, 1987, pp. 15-21.

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