Aluminum film coated copper material

Details Aluminum film coated copper material Aluminum film coated copper material

1987-09-22

1988-07-05

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428938, B32B 1520

Patent

active

047554380

ABSTRACT:
An aluminum film deposited copper material capable of being effectively used as a wiring and a heat sink for various electronic elements, an electrical wire, a cable, and the like while preventing diffusion and penetration of copper atoms into a different element. The copper element includes an aluminum film formed on a copper base according to an ion beam deposition techniques. Thus, the aluminum film may be deposited on the copper base with adhesion and denseness sufficient to block diffusion or exudation of copper atoms into the deposited aluminum film. Also, the aluminum film may be deposited in a thickness sufficient to ensure physical and electrical characteristics of copper.

REFERENCES:
patent: 4091138 (1978-05-01), Takagi et al.
patent: 4152478 (1979-05-01), Takagi
patent: 4355082 (1982-10-01), Bischoff et al.
patent: 4446197 (1984-05-01), Benko
patent: 4521476 (1985-06-01), Asai et al.

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