Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1987-10-13
1989-06-27
Rutledge, L. Dewayne
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428650, 428653, 428432, 428901, B32B 1504, B32B 1706
Patent
active
048429597
ABSTRACT:
This invention provides an aluminum enamel board having an electrically insulating glass layer formed on an Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having an aluminum or alloy layer formed on at least one side of a metal plate made of a metal other than aluminum. Since the Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having the aluminum or aluminum alloy layer is used as a board, the adhesion strength between the metal plate and the electrically insulating glass layer can be increased. At the same time, a predetermined material is used to form the electrically insulating glass layer, thereby minimizing a difference in thermal conductivity and thermal expansion coefficient between the electrically insulating glass layer and the metal plate. This improves the heat conduction characteristics of the board and prevents warping of the board.
REFERENCES:
patent: 3586614 (1971-06-01), Boggs et al.
Low Expansion Porcelain-Coated Copper-Clad Invar Substrates, K. W. Hang et al; RCA Review, vol. 45, Mar. 1984.
Optimization of RCA Porcelain for Compatibility with Thick Films, A. N. Prabhu et al., RCA Review, vol. 42, Jun. 1981.
Characterization of Thick Film Compositions on Porcelainized Steel Substrates; T. R. Allington, R. E. Cote, E. I. du Pont de Nemours & Co., Niagara Falls, NY Proc. 1978 int, Microel Symposium.
Denshi Zairyo (Electronics Material), May 1987.
Denshi Gijutsu (Electronics Technology), 1985/12 Extra edition.
Fukuoka Shingoro
Maeda Ryu
Yatabe Hiroshi
Rutledge L. Dewayne
The Furukawa Electric Co. Ltd.
Wyszomierski George
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