Aluminum electroplating solution

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C25D 344

Patent

active

043790305

ABSTRACT:
Electrolyte liquid for the electrodeposition of aluminum, consisting of a solution of a ligand of one or more aluminum halohydrides in an aprotic solvent. The ligand is, for example, tetrahydrofuran or triethylamine. This liquid makes it possible to deposit ductile aluminum up to high current densities.

REFERENCES:
patent: 4145261 (1979-03-01), Daenen
patent: 4222827 (1980-09-01), Daenen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Aluminum electroplating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aluminum electroplating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aluminum electroplating solution will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-564798

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.