Aluminum electroplating method

Details Aluminum electroplating method Aluminum electroplating method

1990-05-15

1991-08-20

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

C25D 344

Patent

active

050411942

ABSTRACT:
There is disclosed an aluminum electroplating method, which compriss using a low melting composition comprising a mixture of 20 to 80 mole % of an aluminum halide and 80 to 20 mole % of an onium halide of a nitrogen-containing compound selected from the group consisting of bicyclic quaternary amidinium halides, 1-alkylaminopyridinium halides, trialkylimidazolium halides, benzimidazolium halides, alicyclic quaternary ammonium halides and asymmetric tetraalkylammonium halides.

REFERENCES:
patent: 2446331 (1948-08-01), Hurley
patent: 2446350 (1948-08-01), Wier
patent: 4071415 (1978-01-01), Wong
patent: 4747916 (1988-05-01), Kato et al.
patent: 4904355 (1990-02-01), Takahashi et al.

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