Aluminum deposition on semiconductor bodies

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156643, 156646, 427 88, 427 91, 427252, 427255, 427299, B05D 306, C23C 1100

Patent

active

044606184

ABSTRACT:
Aluminum conductor tracks are formed e.g. on a semiconductor body by vapor depositing a layer of aluminum from tri-isobutyl aluminum and then selectively etching the routing. The surface of the semiconductor body is activated in a hydrogen discharge in the presence of a transport metal.

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patent: 4148965 (1979-04-01), Jelli
Pierson, "Aluminum Coatings by the Decomposition of Alkyls", p. 257, Apr. 8, 1977.
Hiler et al., "Development of a Method to Accomplish Aluminum Deposition by Gas Plating,"0 WADC Tech. Report, pp. 13, 20, 24 & 25, Jun. 1959.
Powell, "Chemically Deposited Metals" Vapor Deposition, edited by Powell et al., pp. 277-283, 1966.

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