Aluminum copper oxide based memory devices and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S529000, C438S381000, C365S148000

Reexamination Certificate

active

08067815

ABSTRACT:
Memory devices are described along with methods for manufacturing. A memory device as described herein includes a first electrode and a second electrode. The memory device further includes a diode and an anti-fuse metal-oxide memory element comprising aluminum oxide and copper oxide. The diode and the metal-oxide memory element are arranged in electrical series between the first electrode and the second electrode.

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patent: 7053406 (2006-05-01), Ho et al.
patent: 7285464 (2007-10-01), Herner et al.
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patent: 2009/0261343 (2009-10-01), Herner et al.
patent: 583764 (2004-11-01), None
patent: 258840 (2006-07-01), None
Herner, S.B., et al., “Vertical p-i-n Polysilicon Diode with Antifuse for Stackable Field-Programmable ROM,” IEEE IEDM, vol. 25, No. 5, May 2004, 271-273.

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