Aluminum circuit to be disconnected and method of cutting the sa

Details Aluminum circuit to be disconnected and method of cutting the sa Aluminum circuit to be disconnected and method of cutting the sa

1986-01-21

1987-09-01

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29847, 219121LG, H05K 100, B23K 2600

Patent

active

046910786

ABSTRACT:
In order to cut a portion of an aluminum interconnection to be disconnected in an aluminum circuit, the aluminum interconnection portion in the region to be cut is covered with a hydrogen-containing silicon nitride film by plasma CVD and is then irradiated with laser beams in an operating sequence consisting of three steps: the first step with relatively low power intensity and long irradiation time duration, the second step with intermediate power intensity and short irradiation time duration and the third step with relatively high power intensity and shortest irradiation time duration.

REFERENCES:
patent: 4424621 (1984-01-01), Abbas et al.
Aggarwal, B. K. et al; Laser Cutting Metal Through Quartz; IBM Technical Disclosure Bulletin; vol. 22, No. 5; Oct. 1979; pp. 1971-1972.
Myron J. Rand, "Reliability of LSI Memory Circuits Exposed to Laser Cutting", 17th annual proceedings, Reliability Physics 1979, pp. 220-225.
Robert T. Smith et al., "Laser Programmable Redundancy and Yield Improvement in a 64K Dram", IEEE Journal of Solid-State Circuits, vol. SC-16, No. 5, Oct. 1981, pp. 506-514.

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