Aluminum/ceramic bonding substrate and method for producing...

Details Aluminum/ceramic bonding substrate and method for producing... Aluminum/ceramic bonding substrate and method for producing...

2006-09-22

2008-07-01

Hendricks, Keith D. (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S621000, C428S652000, C428S457000

Reexamination Certificate

active

07393596

ABSTRACT:
When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the aluminum plate to 10 mm or less while preventing the drop in thermal conductivity of the aluminum plate from the thermal conductivity of a pure aluminum plate from exceeding 20% of the thermal conductivity of the pure aluminum plate is added to the molten aluminum. When an aluminum alloy plate of an aluminum-silicon alloy is bonded directly to a ceramic substrate by cooling and solidifying a molten aluminum-silicon alloy which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an aluminum-silicon alloy containing 0.1 to 1.5 wt % of silicon and 0.03 to 0.10 wt % of boron is injected into the mold.

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JP 09-315875 English Machine Translation, Aluminum-Ceramic Composite Substrate and its Production, Dec. 1997.

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