Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
Reexamination Certificate
2005-09-13
2005-09-13
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having air-gap dielectric
Reexamination Certificate
active
06943090
ABSTRACT:
A typical air bridge is an aluminum conductor suspended across an air-filled cavity to connect two components of an integrated circuit, two transistors for example. The air-filled cavity has a low dielectric constant which reduces cross-talk between neighboring conductors and improves speed and efficiency of the integrated circuit. However, current air bridges must be kept short because typical aluminum conductors sag too much. Accordingly, one embodiment of the invention forms air-bridge conductors from an aluminum-beryllium alloy, which enhances stiffness and ultimately provides a 40-percent improvement in air-bridge lengths.
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Coleman W. David
Micro)n Technology, Inc.
Schwegman Lundberg Woessner & Kluth P.A.
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