Aluminum-based solder material

Details Aluminum-based solder material Aluminum-based solder material

1995-06-22

1997-04-08

Wyszomierski, George

Metal treatment

Process of modifying or maintaining internal physical...

Producing or treating layered, bonded, welded, or...

148535, 148440, 420546, 420556, 22826251, C22C 2100, B23K 3528

Patent

active

056183577

ABSTRACT:
A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that especially contains about 10 to 50 wt. % of germanium, about 1 to 12 wt. % of silicon, about 0.1 to 3 wt. % of magnesium, and about 0.1 to 3 wt. % of indium. The solder material is useful at soldering temperatures in the range from 424.degree. to about 600.degree. C., and is therefore especially suitable for the fluxless hard soldering of components made of precipitation-hardened high-strength aluminum-based materials.

REFERENCES:
patent: 5158621 (1992-10-01), Das et al.
patent: 5286314 (1994-02-01), Das et al.

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