Aluminum-based intermetallic compound with high toughness and hi

Metal treatment – Stock – Aluminum base

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148415, 148416, 148417, 148418, 148419, 148438, 148439, 148440, C22C 2100

Patent

active

053001575

ABSTRACT:
An Al-based intermetallic compound in which a eutectic crystal type Al-CuMn intermetallic compound dispersion phase is dispersed in an Al-Cu intermetallic compound matrix phase. The content of Mn as a eutectic crystal-forming element contained in the dispersion phase is set in a range of from 5% by weight (inclusive) to 30% by weight (inclusive). In the course of solidification of the Al-Cu-Mn intermetallic compound, an infinite number of dispersion phases are first crystallized, and the matrix phase is then crystallized. This ensures that the matrix phase is formed into a fine crystal structure due to hindrance of the growth thereof by the dispersion phase, leading to increases in hardness and toughness of the resulting Al-based intermetallic compound. In another embodiment, the Al-based intermetallic compound contains peritectic type Al-based intermetallic dispersion phase, such as formed by Ta, dispersed in the intermetallic compound matrix phase.

REFERENCES:
patent: 4767678 (1988-08-01), Yates et al.
patent: 5053085 (1991-10-01), Masumoto et al.
patent: 5076866 (1991-12-01), Koike et al.

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