Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product
Patent
1999-02-24
2000-09-26
Jenkins, Daniel J.
Powder metallurgy processes
Powder metallurgy processes with heating or sintering
Metal and nonmetal in final product
419 17, 419 29, 419 39, 419 45, 419 57, B22F 324, B22F 312
Patent
active
061238953
ABSTRACT:
A member for semiconductor devices comprising a composite alloy of aluminum or an aluminum alloy and silicon carbide, wherein silicon carbide grains are dispersed in aluminum or the aluminum alloy in an amount of from 10 to 70% by weight, the amount of nitrogen in the surface of the member is larger than that in the inside thereof, and the ratio of aluminum or the aluminum alloy to silicon carbide is the same in the surface and the inside. The member is produced by mixing powdery materials of aluminum or an aluminum alloy and silicon carbide, compacting the mixed powder, and sintering the compact in a non-oxidizing atmosphere containing nitrogen gas, at a temperature between 600.degree. C. and the melting point of aluminum. The member is lightweight and has high thermal conductivity as well as thermal expansion coefficient which is well matches with that of ceramics and others. Therefore, the member is especially favorable to high-power devices.
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"A Review of Substrate Materials for Power Hybrid Circuits", by Fuchs et al., International Journal of Microcircuits and Electronic Packaging, vol. 20, No. 1, Apr. 1, 1997, pp. 61-66.
Fukui Akira
Kawai Chihiro
Suwata Osamu
Takeda Yoshinobu
Yamagata Shin-ichi
Jenkins Daniel J.
Sumitomo Electric Industries Ltd.
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