Aluminum alloy semiconductor packages

Details Aluminum alloy semiconductor packages Aluminum alloy semiconductor packages

1988-10-05

1990-07-03

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29827, H01L 2306

Patent

active

049393162

ABSTRACT:
The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

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Degarmo, Materials and Processes in Manufacturing, The MacMillan Company, 1957, New York, p. 720.

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