Aluminum alloy semiconductor packages

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

357 74, 29827, H01L 2302, H01R 4300

Patent

active

051552990

ABSTRACT:
The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.

REFERENCES:
patent: 3689732 (1972-09-01), Hill
patent: 3767839 (1973-10-01), Beal
patent: 3871018 (1975-03-01), Jackson et al.
patent: 4105861 (1978-08-01), Hascoe
patent: 4202700 (1980-05-01), Wilder
patent: 4410927 (1983-10-01), Butt
patent: 4461924 (1984-07-01), Butt
patent: 4480262 (1984-10-01), Butt
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4521469 (1985-06-01), Butt et al.
patent: 4524238 (1985-06-01), Butt
patent: 4525422 (1985-06-01), Butt et al.
patent: 4542259 (1985-09-01), Butt
patent: 4572924 (1986-02-01), Wakely et al.
patent: 4582556 (1986-04-01), Butt et al.
patent: 4594770 (1986-06-01), Butt
patent: 4656499 (1987-04-01), Butt
patent: 4704626 (1987-11-01), Mahulikar et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4711826 (1987-12-01), Shapiro et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4775647 (1988-10-01), Smith, III
patent: 4784974 (1988-11-01), Butt
patent: 4796083 (1989-01-01), Cherukuri et al.
patent: 4888449 (1989-12-01), Crane et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 5013871 (1991-05-01), Mahulikar et al.
Beradinis, "The packaging Hurdle" appearing in MACHINE DESIGN, Apr. 25, 1991 at pp. 55-64.

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