Alpha tantalum capacitor plate

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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C361S312000, C361S313000, C361S321100, C361S321200, C361S301400

Reexamination Certificate

active

07969708

ABSTRACT:
A method for forming an alpha-tantalum layer comprising disposing a nitrogen containing base layer on a semiconductor substrate, bombarding the nitrogen containing base layer with a bombarding element, thereby forming an alpha-tantalum seed layer, and sputtering a layer of tantalum on the alpha-tantalum seed layer, thereby forming a surface layer of substantially alpha-tantalum.

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patent: 7662488 (2010-02-01), Oshima
patent: 7674699 (2010-03-01), Shibata
Wang, J.H., et al., “Ta and Ta—N diffusion barriers sputtered with various N2/Ar ratios for Cu metalization,” JVST B 20(4)—Microelectronics and Nanometer Structures, American Vacuum Society, Jul./Aug. 2002, pp. 1522-1526.

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