Alpha-particle protection of semiconductor devices

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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428414, 428448, 4284735, 428353, 428354, 428901, 174 685, C09J 702, H05K 100, H01L 2328

Patent

active

047613351

ABSTRACT:
The present invention is a tape product suitable for use in the protection of semiconductor devices from alpha-particles. The product comprises a heat resistant support film, a pressure sensitive adhesive layer on one side of the support film, a least one alpha-particle protector member formed of a plastic material capable of protecting the semiconductor device releasably supported on the pressure sensitive adhesive, and a layer of heat resistant adhesive bonded to the plastic material on its side lying opposite to the side bonded to the pressure sensitive adhesive. Preferably, a primer layer lies between the heat resistant support film on the pressure sensitive adhesive to insure that clean removal of the support film and pressure sensitive adhesive from the surface of the alpha-particle protector member. In order to aid in this removal the surface of the alpha-particle protector member facing the pressure sensitive layer is also coated with a release coating. The product is used by bonding the heat resistant adhesive side of the transfer tape product to one or more die patterns on a semiconductor wafer and by then stripping the support film and pressure sensitive adhesive from the top surface of the applique after the applique.

REFERENCES:
patent: 3565743 (1971-02-01), Kallenberg et al.
patent: 4380566 (1983-04-01), Phy
patent: 4543295 (1985-09-01), St. Clair et al.
patent: 4653175 (1987-03-01), Brueggeman et al.

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